| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent plating solution from penetrating into a chip element, keeping the chip element high in solderability and solder wettability. SOLUTION: A chip-type electronic component is provided with a chip element 4 formed of ceramic material, terminal electrodes 1 provided to the chip element 4, and plating films 2 and 3 formed on each of the terminal electrodes 1, where the terminal electrode 1 is formed of conductive terminal material to contain conductive glass frits of 10 PHP or larger [where PHP denotes the amount (wt.%) of glass frits, when the total amount (wt.%) of all inorganic material is represented by 100%].</p> |
