SUPPORTING STRUCTURE OF SEMICONDUCTOR WAFER

摘要

PROBLEM TO BE SOLVED: To provide a supporting structure for a semiconductor wafer which prevents the slip-dislocation of a wafer as the semiconductor wafer is supported. SOLUTION: A silicon wafer W is placed on a wafer placing part 13b of a wafer holder 13 and is heat treated with a rapid heating apparatus 10. Even if the wafer W deflects under an oven heat, the concentration of the wafer weight into a part at the wafer peripheral part contacting an upper-side corner part S is relaxed since the outer edge part of a tapered surface 13c which is the upper-side corner part S at the inner peripheral edge of the wafer placing part 13b is beveled. As a result, the internal stress of the wafer W becomes hard to exceed a critical shearing stress compared with the conventional cases. So, the occurrence of slip-dislocation, as the silicon wafer W is supported, is prevented.