ELECTRIC CIRCUIT BOARD AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayer electric circuit board wherein selective and effective wiring is enabled with high reliability in parts between some or all components of various kinds, which components contains components positioned on a surface or a part of the formed multilayer electric circuit board, and a part or all of defects of the conventional manufacturing method and manufacturing technique of a multilayer electric circuit board are conquered. SOLUTION: In a connection forming method in a multilayer electric circuit board, a process for forming an aperture in a circuit board, and a process for selectively covering an inner surface of the aperture by using mask material effectively bonded with solder which is selectively inserted in the aperture and has polarity are installed. Thereby the solder is held in the aperture, and reliability of electrical connection with solder is improved.