发明名称 CIRCUIT BOARD UNIT AND ELECTRONIC EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To effectively arrange the components of electronic equipment in a limited space and to effectively cool the components of the electronic equipment. SOLUTION: A heat sink 307 with integrated heat radiating fins 306 and a shield 308 are sandwiched between a main board 381a and a power source board 381b. The heat radiating fins 306 are covered with a hood 142d to gather air for cooling. Principal components of the main board 381a and the heat sink 307 are brought into contact with each other across heat conductive members which are different in heat conductivity by the components to make the heat distribution uniform.
申请公布号 JP2002134968(A) 申请公布日期 2002.05.10
申请号 JP20000325992 申请日期 2000.10.25
申请人 SONY COMPUTER ENTERTAINMENT INC;FURUKAWA ELECTRIC CO LTD:THE 发明人 SASAKI CHIKA;HIRATA KOJI;ITO KATSUSHI;OTORI YASUHIRO;KUBOTA RYOICHI
分类号 G06F1/20;H05K1/02;H05K1/14;H05K7/20;(IPC1-7):H05K7/20 主分类号 G06F1/20
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