CHIP CARRIER FILM, ITS MANUFACTURING METHOD AND LIQUID CRYSTAL DISPLAY USING THE CHIP CARRIER FILM

摘要

PROBLEM TO BE SOLVED: To provide a chip carrier film that is free from sag of a base film caused by own weight of semiconductor chips when the base film is held by a transfer apparatus and can be mounted without trouble. SOLUTION: This chip carrier film comprises the metal wiring formed on the surface of a base film, a first insulation film covering the metal wiring except for semiconductor chip connecting pads and terminal connecting pads, semiconductor chips attached on the base film being connected to the semiconductor chip connecting pads of the metal wiring, and a second insulation film formed on the rear surface of the base film, having a different curing contraction percentage from that of the first insulation film.