| 摘要 |
PROBLEM TO BE SOLVED: To provide a new manufacturing method of a hybrid integrated circuit device where as components are arranged in good order from processes for mounting the small-sized to the large-sized components, the respective components are individually mounted on a hybrid integrated circuit board, consequently, to make smooth progress regardless of the kind of products. SOLUTION: The manufacturing method of a hybrid integrated circuit device is provided with a process for mounting circuit elements 4, 7 and 11, which are secured on the desired conducting path 2 on a hybrid integrated circuit board 1 with at least a conductive brazing metal 3, en block on the path 2 and a process for securing the elements 4, 7 and 11 en block on the path 2 by fusing the brazing metal 3, specially, a medium speed mounter and a multifunction mounter are installed within a line for conducting a chip mounting process using the brazing metal 3 and the elements 4, 7 and 11 are dividedly mounted on each mounter so as to finish the work within the set hours of each mounter, whereby a deviation of the working hours in the chip mounting process is adjusted and a smooth line work is conducted.
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