SEMICONDUCTOR MOUNTING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor mounting method that can align each mounting position of a semiconductor with a circuit board and can confirm the bonding condition after the mounting briefly and easily. SOLUTION: By using a transparent body of silicon carbide as the substrate of a semiconductor 6 in exchange for conventional opaque silicon, positioning confirmation marks 6a, 2a of the semiconductor 6 and the circuit board 2 respectively become visible at a time from one direction. Hereby, since not only the periphery of a bump but also whole bonded area is visible, it is possible to bond or modify by ultraviolet light or laser light.