| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer circuit board which is excellent in low dielectric characteristic with small dielectric loss and has sufficient mechanical strength. SOLUTION: In this multilayer circuit board, insulator layers 3, alloy foils 2 for holding the insulator layers 3 and a plurality of circuit wirings 4 are installed, and the respective layers of the circuit wiring 4 are electrically connected at prescribed positions by using electric continuous paths 5 which penetrate the insulator layers 3 and the alloy foils 2. The insulator layers 3 are composed of porous thermal resistance material. |
