| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board wherein density is high, reliability is superior and spaces between layers are connected with conductive paste, and a method for manufacturing the printed wiring board with high efficiency. SOLUTION: This method for manufacturing a printed wiring board consists of (a) a process for temporarily sticking an insulating adhesive film 3 on the surface of a wiring board 2 on which a circuit 1 is formed, (b) a process for forming via holes 4 on the insulating adhesive film, (c) a process wherein the via holes are filled with conductive paste 5, (d) a process wherein metal foils 7 are pressed and the wiring board and the conductive paste are bonded and collectively formed integrally with the metal foils 7, (e) a process for forming a conductor pattern 9 on the outside metal foil by using an etching method, and (f) a process for manufacturing a multilayer printed wiring board wherein processes from (a) to (f) are repeated when layers are laminated furthermore. |
