| 摘要 |
PROBLEM TO BE SOLVED: To provide a reflow soldering device which smoothens the flow of the hot air so as to make uniform the temperature distribution of a printed board mounted with an electronic component. SOLUTION: A reflow soldering device is constituted in a structure that the hot air is blown on a printed board mounted with an electronic component in a heating furnace while the printed board is transferred on a conveyer chain. A plurality of air ducts 35 having each opening 35a for making the hot air flow in the heating furnace on the sides of the furnace which face the board are provided on the surfaces, which oppose the board, of the furnace at intervals in the transfer direction of the chain and these air ducts 35 respectively have a first passage that the hot air in the air duct 35 flows from an opening formed in the intermediate part of the air duct 35 to a fan and a second passage that the hot air in the air duct 35 flows from openings 35b formed in both end surfaces of the air duct 35 to the fan. |
