| 摘要 |
PROBLEM TO BE SOLVED: To provide the formation method of a pattern for forming a fine resist pattern in the substrate surface with uniform dimensional accuracy, without having to increase manufacturing costs and treatment time. SOLUTION: In this pattern formation method, after a first resist pattern 2 containing a photoacid generator has been formed on a substrate 1 through lithographic method, a resist film 5 containing a crosslinking agent reaction to an acid is applied onto the substrate 1; and while the first resist pattern 2 is being covered, crosslinking reaction is generated on the interface between the first resist pattern 2 and resist film 5 for growing a crosslinking layer 7, and a second resist pattern 10 comprising the crosslinking layer 7 and first resist pattern 2 is formed. In this case, before the resist film 5 is applied onto the substrate 1, light 3 is applied to the first resist pattern 2. |
