发明名称 METHOD AND DEVICE FOR ELECTRONIC PROFILING MACHINING
摘要 PROBLEM TO BE SOLVED: To provide a method and a device for electronic profiling machining which machine a large-sized work in a short time with high precision by completing the processing from NC program generation to the end of machining in a short time. SOLUTION: Three-dimensional electronic data on the work 4 in the form of a product and machining definition data on a tool diameter, a revolving speed, a feed speed, a pick feed, etc., are inputted and the work is machined while processing paths are sequentially computed from the data.
申请公布号 JP2002132314(A) 申请公布日期 2002.05.10
申请号 JP20000318671 申请日期 2000.10.19
申请人 TOSHIBA CORP 发明人 ARAI SHINJI
分类号 B23Q15/00;B23Q35/12;G05B19/4093;G05B19/4097;(IPC1-7):G05B19/409;G05B19/409 主分类号 B23Q15/00
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