| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for easily and efficiently manufacturing a shelled electronic component. SOLUTION: With respect to the method for forming the shell of an electronic component by placing face-to-face and bonding upper and lower shell elements 10 and 20, a gap 80 to be filled with fused resin is formed on the facing surfaces 12 and 22 of the upper and lower shell elements 10 and 20 when they are placed face-to-face. Cavities 61 and 71 are formed in shell sealing metal molds 60 and 70 for housing the shell elements 10 and 20 and when the upper and lower shell elements 10 and 20 are housed in the cavities 61 and 71, the molds are closed. After that, the gap 80 is filled with fused binder resin 41, and the resin 41 is cooled and solidified for coupling and adhering the facing surfaces 12 and 22 of the upper and lower shell elements 10 and 20. In this way, the electronic component is sealed with the shell and the water tightness and the dust tightness is ensured.
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