| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin-molded wiring board which eliminates the need of works of masking non-soldering parts, etc., in flow soldering. SOLUTION: The resin-molded wiring board with a resin-molded wiring frame 4 comprises a solder mounting part 1a for soldering a variety of components and non-soldering part 1b for soldering nothing on one surface of the board, and a step 5 provided for locating the non-soldering part 1b at a higher level than the solder mounting part 1a.
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