| 摘要 |
<p>The invention relates to a device for sintering, removing material and/or labeling by means of electromagnetically bundled radiation, especially to a laser sintering machine and/or a laser surface-processing machine. Said device comprises a construction space (3) which is accommodated in a machine housing (2) and in or above which the following are located: a light-guiding device, especially a scanner (4), into which the beam of a sintering energy source is coupled; a vertically displaceable workpiece platform (7); and a material supply device comprising a coater (9) for supplying sintering material from a supply container (8) to the process area above the workpiece platform (7). Said workpiece platform (7) is a changeable element which can be removed from the construction space (3). The vertically displaceable workpiece platform (7), the supply container (8) and the coater (9) are configured in such a way that they can be removed together from the construction space (3) in the form of a changeable process platform unit (10). Other changeable process platform units (10) with the same or different configurations can be introduced into the construction space (3) in order to carry out the same or different processing operations.</p> |
