| 摘要 |
PROBLEM TO BE SOLVED: To prevent stoppage of a wire bonding machine in the wire bonding process. SOLUTION: A semiconductor device of this invention comprises a semiconductor chip loaded on a board, a package that has a case with electrode terminals formed by insertion and accommodates the board and the semiconductor chip, and bonding wires connecting the semiconductor chip with the electrode terminals. The case has an identification mark so as to decide a connecting position of the bonding wires when the bonding wires are connected. |
