| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and its inspection method capable of performing photo-emission analysis without processing the upper layer wiring part and the like of an IC chip. SOLUTION: A plurality of electrode lands and wiring patters such as wiring are mounted on the surface of IC (semiconductor device) 10, an IC chip 11 is mounted faceup on the surface of a package board 12 forming a plurality of electrode bumps 15 corresponding to the wiring pattern on the rear face, sealed by a sealing resin 14, and a display 16 indicating the position of the IC chip 11 is adhered. The inspection method of the cause of a case that the IC chip 11 produces some defect is a method for inspecting and analyzing the cause of the defect by a photo-emission analyzing method by mounting the IC chip 11 on a test board to be energized and actuated after the package board 12 of an area surrounded by the display 16 is removed from the rear face to open an opening. |
