| 摘要 |
<p>PROBLEM TO BE SOLVED: To solve the problem of cracks that occur on a connection terminal connecting an insulation board and an outer circuit board in the case that a temperature cycle test is performed, or cracks and peeling that occur on an adhesion resin connecting a cover body and the insulation board. SOLUTION: In a semiconductor device A provided with the plate-like cover body 3 mounting a semiconductor element 2 on the surface of the insulation board 1, attached to the surface of the insulation board 1 so as to cover the semiconductor element 1 and adhering a part thereof through a heat conduction resin 9 on the upper face of the semiconductor element 2 and mounted on the outer circuit board 11 through the connection terminal 10, thermal expansion coefficients lessen in order of the outer circuit board 11, the insulation board 1 and the cover body 3, the cover body 3 and the insulation board 1 are adhered by the adhesion resin different in Young's modulus, the adhesion resin 4b of large Young's modulus is positioned in the inside of the cover body 3 more inward than the adhesion resin 4a of small Young's modulus. The cracks and peeling do not occur on the connection terminal and the adhesion resins 4a, 4b.</p> |
