| 摘要 |
PROBLEM TO BE SOLVED: To prevent entry of moisture through a gap between a case body and a resin part of an electronic circuit board case which is provided with the resin filler in the metal case body, to improve heat radiation of the housed electronic circuit board, and to prevent separation of the resin filler from the case body. SOLUTION: The inner wall of the case body 10 is covered with resin by molding except a part to form a case body exposed part 16 and the resin filler 12. An adhesive 32 is applied for covering at least the interface between the case body exposed part 16 and the resin part 16 and the electronic circuit board 30 is fixed. Also, projections 26 are formed on the case body 10 so that the interface to the resin filler 12 exhibits projections. Further, a through hole 28 is made in the case body 10 in such a way that its diameter increases from the inner wall toward the outer wall and the resin filler 12 is formed in its inside.
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