| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper foil for printed boards which maintains a stable adequate electrodeposition grain shape even on a rolled copper foil having a nonuniform surface condition, and forms a desired uniform roughened plating of electrodeposition grains on the nonuniformly conditioned surface of the rolled copper foil, thereby improving the adhesion of the roughened electrodeposition plating copper foil to a resin board. SOLUTION: The copper foil for printed boards has a roughened plating surface. Prior to the roughening plating, the foil surface is pre-roughened into a pre-roughened surface having a roughness Ra of 200 nm or more but less than 500 nm in measurement using an interatomic force microscope. The copper foil is dipped in a specified treating solution and set to a negative electrode to apply electrodeposition metal grains preferably such as copper grains of 1-3μm onto the pre-roughened surface, thereby forming a roughened plating surface.
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