An air dielectric backplane interconnection system is disclosed. The interconnection system disclosed is a high speed backplane interconnection system (5) having a plurality of conductor matched impedance transmission line elements (15) and an air dielectric surrounding the plurality of transmission line elements. An interconnection system also having spacers (20) disposed between the transmission line elements and a ground plate (25) is disclosed.
申请公布号
WO0237598(A1)
申请公布日期
2002.05.10
申请号
WO2001US47589
申请日期
2001.11.05
申请人
FCI AMERICAS TECHNOLOGY INC.
发明人
GARRETT, RICHARD, H.;ELCO, RICHARD, A.;LEMKE, TIMOTHY, A.