发明名称 ARRANGEMENT FOR COOLING A COMPONENT GENERATING HEAT ENERGY USING COOLING FLUID
摘要 The invention relates to an arrangement for cooling a component (2) generating heat energy. The component (2) is placed in an enclosure (3). The enclosure (3) comprises cooling fluid input means (5) for directing cooling fluid to the enclosure (3) and cooling fluid output means (6) and for removing cooling fluid from the enclosure (3). The enclosure (3) is of such a type that is arranged to be mounted into an apparatus rack (1). The arrangement comprises a cooling fluid distribution system (7) having second cooling fluid input and output elements (8a and 8b) to which the cooling fluid input and output means (5 and 6) of the enclosure (3) are connected, so that cooling fluid can be directed to the enclosure (3) from the cooling fluid distribution system (7) and removed from the enclosure (3) to the cooling fluid distribution system (7).
申请公布号 WO0237914(A1) 申请公布日期 2002.05.10
申请号 WO2001FI00957 申请日期 2001.11.01
申请人 NOKIA CORPORATION;MUSTAKALLIO, JYRKI 发明人 MUSTAKALLIO, JYRKI
分类号 H01L23/467;(IPC1-7):H05K5/20 主分类号 H01L23/467
代理机构 代理人
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