| 摘要 |
A transmission line member is constituted as a mirostrip line comprising a conductor line formed on a top surface and a conductor layer formed over an entire back surface. A high frequency signal input to an electrode of a package is transmitted via a bonding wire, the transmission line member, and a bonding wire, to an electrode of a semiconductor laser. As dielectric loss is slight, the transmission line member can transmit a high frequency signal with little loss, thereby improving the high frequency characteristics of a signal to be input to the semiconductor laser. |
