| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an electrostatic chuck which can uniformly heat semiconductor wafers because it is able to control the temperature of chuck surface uniformly. SOLUTION: A temperature controlling means is provided on a ceramic substrate, while electrostatic electrodes are formed on the ceramic substrate, and a ceramic dielectric layer is provided on the electrostatic electrodes. RF electrodes or ground electrodes are provided between the temperature controlling means and the electrostatic electrodes.</p> |
