| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a wafer support bracket which suppresses slipping of a wafer by suppressing deformation of the wafer support bracket in heat treatment. SOLUTION: A wafer support bracket 11 for heat treatment comprises at least one concentric protruding flat support part 21 on its upper surface, with a recessed part 31 radially formed into which a transportation chuck 51 for placing a wafer is inserted. Otherwise, a wafer support bracket 12 for thermal process comprises at least one concentric protruding flat support 21 on its upper surface, and a notch part 32 which is cut radially, with a plate-like reinforcing structure 33 formed vertical to the plate surface at the end part of the notch part 32.</p> |
