| 摘要 |
PROBLEM TO BE SOLVED: To increase a damping amount in a high frequency attenuation area, realize reduction in size and weight, enhance production efficiency, and realize a low price. SOLUTION: A surface acoustic wave device has a metallic lead frame formed with a plurality of inner leads 9 and mounts a chip 1 comprising at least one piezoelectric substrate to a resinous base 3 in which the lead frame is integrated. The surface acoustic wave device comprises a wire lead metal surface 7a formed by exposing a wire lead 7 which is electrically connected to an electrode of the chip by a bonding wire 4 from the resinous base, and a chip lead metal surface 10a formed by exposing a chip lead 10a part of which is coated with the chip out of an inner lead from the resinous base. |
