EXPOSURE EQUIPMENT FOR FABRICATING SEMICONDUCTOR DEVICE

摘要

PURPOSE: Exposure equipment for fabricating a semiconductor device is provided to prevent a pattern defect of a wafer from being caused by particles, by eliminating the particles on a wafer stage or the back surface of the wafer before an exposure process is performed. CONSTITUTION: The wafer(216) on which photoresist is applied is settled on the wafer stage(214). A pattern is formed on a reticle(212) installed in the upper portion of the wafer stage. A lens unit is installed between the reticle and the wafer stage. When an isolation space is formed between the upper surface of the wafer stage and the bottom surface of the wafer, an air cleaner(235) generates flow of fluid in the isolation space. A fluid flow unit generates flow of the fluid in the air cleaner. A particle removing unit(230) removes the particles on the upper surface of the wafer stage and on the bottom surface of the wafer. A control unit(220) controls the exposure equipment and the particle removing unit.