| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus for plating, which keeps the reacting surface of a semiconductor substrate constantly and accurately at a predetermined temperature during plating reaction, plates the substrate stably and surely, and improves throughput. SOLUTION: This apparatus for plating comprises a plating bath 10 as a thermostatic chamber which maintains the temperature to be higher in the inside space than the outside air. The plating bath 10 comprises a holding means 11 for holding a surface to be plated of the semiconductor substrate upward- facing, a sheathing member 15 for sealing perimeter of the plated surface of the semiconductor substrate W held by the holding means 11, and a showerhead 19 for supplying a plating solution on the plated surface of the semiconductor substrate W sealed with the sheathing member 15.
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