| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for plating an electronic component without deteriorating a plating solution or generating problem due to manual washing, which prevents a ceramic element from jumping out when charging it into the plating solution, and improves a product yield. SOLUTION: This method for plating an electronic component, which accommodates the ceramic element 1 as a substance to be plated in a basket 11 having an input port 11a upward opened, immerses the above basket 11 into a plating solution tank 27, and forms a plated film on the above ceramic element 1 in the immersed condition, is characterized by a pre-treating process before immersing the above basket 11 into the plating solution tank 27, which wets the ceramic element 1 with an alcohol based liquid having satisfactory wettability with the above ceramic element 1 and volatility, and then immerses the above basket 11 into the plating solution tank 27.
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