发明名称 POWDER COMPACTING DIE AND POWDER COMPACTING METHOD USING THE DIE
摘要 PROBLEM TO BE SOLVED: To draw out a compact having high density under lower pressure by improving the wear resistance of a powder compacting die and reducing the friction of the surface of the die and to efficiently compact a high density sintered product. SOLUTION: In the powder compacting die in which the die having inner holes for forming the outside shape of the compact and consisting of a hard material is inserted into the inner holes of a die holder, the inner holes of the die have the taper of 1/5,000 to 1/1,000 expanding toward the compact drawing side, a single coating layer or a plurality of coating layers of at least one or more kinds selected from TiC, TiN, Al2O3, TiCN, HfN, CrN, W2C and DLC are formed on the surface of the die, and the material of the die holder is composed of ordinarily used steel whose tempering temperature is higher than the coating treating temperature.
申请公布号 JP2002129201(A) 申请公布日期 2002.05.09
申请号 JP20000322890 申请日期 2000.10.23
申请人 HITACHI POWDERED METALS CO LTD 发明人 SUGAYA YOSHIMI;IWAKIRI MAKOTO
分类号 B30B11/00;B22F3/02;B22F3/03;B22F3/035;B30B11/02;B30B15/02;C22C38/00;C22C38/52;C23C14/06;C23C16/26;C23C16/27;C23C16/30;C23C16/34;C23C16/36;C23C16/40;C23C30/00;(IPC1-7):B22F3/035 主分类号 B30B11/00
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