发明名称 Semiconductor memory device having metal contact structure and method of manufacturing the same
摘要 The present invention discloses a semiconductor memory device having a bit line and a metal contact stud, wherein the metal contact stud is formed on a different layer from a layer on which the bit lines are formed.
申请公布号 US2002053686(A1) 申请公布日期 2002.05.09
申请号 US20010838355 申请日期 2001.04.19
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 SUH CHUNSUK
分类号 H01L27/10;H01L21/768;H01L21/8242;H01L23/522;H01L27/108;(IPC1-7):H01L21/82;G03C5/00;H01L23/48 主分类号 H01L27/10
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