| 发明名称 |
Energy enhanced process for treating a conductive surface and products formed thereby |
| 摘要 |
The disclosure relates to a process for forming a deposit on the surface of a metallic or conductive surface. The process employs an energy enhanced process to deposit a silicate containing coating or film upon a metallic or conductive surface.
|
| 申请公布号 |
US2002054998(A1) |
申请公布日期 |
2002.05.09 |
| 申请号 |
US20010814641 |
申请日期 |
2001.03.22 |
| 申请人 |
HEIMANN ROBERT L.;DALTON WILLIAM M.;HAHN JOHN;PRICE DAVID M.;SOUCIE WAYNE L.;CHANDRAN RAVI |
发明人 |
HEIMANN ROBERT L.;DALTON WILLIAM M.;HAHN JOHN;PRICE DAVID M.;SOUCIE WAYNE L.;CHANDRAN RAVI |
| 分类号 |
C23C28/00;C25D9/04;C25D9/08;H05K3/28;(IPC1-7):B32B9/00;C25D9/00 |
主分类号 |
C23C28/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
