MOUNTING METHOD OF SURFACE MOUNT DEVICE OF FINE PITCH PLASTIC PACKAGE

摘要

PURPOSE: A mounting method of a surface mount device of a fine pitch plastic package is provided to avoid short between pads when a printed circuit board is mounted on a surface mount device. CONSTITUTION: In a mounting method of a surface mount device of a fine pitch plastic package, die pads(32) are formed on a printed circuit board(30). The die pads(32) are formed to have a pattern. A register(35) is formed between the die pads(32). Solder paste is formed on the die pad(32) by a thickness. Flux(38) is permeated through a stencil(36) over the printed circuit board(30) by using a printing squeeze(40). A solder film(54) is formed around leads(52) of a plastic package(50). Using viscosity of the flux(38), the plastic package(50) is disposed on the printed circuit board(30). The leads(52) of the plastic package(50) is attached to the die pads(32) of the printed circuit board(30) by applying reflow.