| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a pressure detection device small in size, highly sensible and capable of accurately detecting an external pressure without the variation. SOLUTION: In a package for the pressure detection device, a semiconductor element 3 is mounted on one side of a main plane of an insulating substrate 1, and a first electrode 7 for generating the electrostatic capacity and a first metallized bounding layer 8 that surrounds the first electrode 7 are disposed on the other side of the main plane. A second electrode 9 opposing to the first electrode 7 and a second metallized bonding layer 10 electrically connected to the second electrode 9 through a connecting metallized layer 11 that surrounds the second electrode 9 and is disposed in the section on outside plane of an insulating plate 2, are disposed on inside plane of the insulating plate 2. The first metallized bonding layer 8 and the second metallized bounding layer 10 are brazed to each other, thereby the insulating plate 2 is bonded on another side of the main plane of the insulating substrate 1 so flexible that a sealed space is formed between the insulating substrate 1 and the insulating plate 2.</p> |
