| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and an apparatus for electroless plating, which simplify the apparatus, reduce the cost, improve throughput, and electroless plate stably and surely. SOLUTION: The method for electroless plating for forming a wiring, a wiring protecting film, or a diffusion preventing film of a semiconductor substrate W with electroless plating comprises steps of; immersing a substrate holding means 10 for holding several pieces of semiconductor substrates W in parallel, into a plating solution of a plating tank 40; keeping the substrate holding means 10 in the plating solution for the predetermined time, and simultaneously electroless plating each surface to be plated of the several semiconductor substrates W; taking the substrate holding means 10 out from the plating solution; immersing the several semiconductor substrates W held in the substrate holding means 10 into a washing tank 51, and simultaneously washing them; and spin rotating the several semiconductor substrates W held in the substrate holding means 10, and simultaneously drying them.
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