| 摘要 |
PROBLEM TO BE SOLVED: To provide an electrodeposited copper foil having a controlled low profile, and a manufacturing method therefor. SOLUTION: The electrodeposited copper foil with the controlled low profile comprises having a uniform structure consisting of substantially random orientated particles in one embodiment, which have an average particle size of up to about 10 micron, with essentially no cylindrical particle and no twin boundary. The manufacturing method of the foil includes; (A) a process of running an electrolytic solution between an anode and a cathode, and applying voltage of valid value between the anode and the cathode so as to precipitate copper on the cathode; wherein the electrolytic solution includes copper ion, sulfate ion and at least one organic additive or its derivative, and restricts the chloride ion concentration in itself to less than 1 ppm approximately; and the current density is in a range of about 0.1-5 A/cm2; and (B) a process of removing the copper foil from the cathode. |
