| 摘要 |
PROBLEM TO BE SOLVED: To provide a small-sized high performance thermal radiation system. SOLUTION: An assembly including an integral formed cooling system, liquid enclosing system, EMI shield, pump housing and heat sink is constituted on a multi-chip module. A fixed device is cooled by atomization of fluid of which phase is changed from liquid to gas at its evaporating point. Condensed liquid is accumulated at the base segments of fins and then collected by a pump for its re-distribution. This pump is connected to a fan blade operated by a motor. A sealing is formed between the multi-chip module and the integral formed housing. This assembly is designed such that the sealing is not needed to be broken for repairing the motor and an amount of vapor lost from the working fluid into atmosphere is made minimum. The case fins and the fan blade are sometimes arranged for increasing its efficiency. |
