发明名称 TOOL FOR CALCINATING ELECTRONIC PART
摘要 PROBLEM TO BE SOLVED: To provide a tool for calcinating an electronic part to remove a binder smoothly and to suppress a reaction between a zirconia surface layer and an electronic part, which is unable to be solved by a conventional performance adjustment of a surface layer by means of adjusting a grain size, with specifying a surface condition of the zirconia surface layer by a surface roughness (convexity and concave). SOLUTION: The surface roughness of the zirconia surface layer of the tool for calcinating the electronic part, which is comprised of a substrate, an intermediate layer coated on the substrate surface and the zirconia surface layer formed on the intermediate layer, is made 10 to 40 μm being indicated as a center line mean value. Without forming the intermediate layer, the zirconia surface layer may be formed directly on the substrate.
申请公布号 JP2002128583(A) 申请公布日期 2002.05.09
申请号 JP20000320663 申请日期 2000.10.20
申请人 MITSUI MINING & SMELTING CO LTD 发明人 TAKAHASHI NORIYUKI;IZUTSU YASUHISA;HOSHINO KAZUTOMO;UCHIDA TOMIHIRO
分类号 C04B41/89;C04B35/64;C04B41/50;C04B41/53;F27D3/12 主分类号 C04B41/89
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