| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing a semiconductor, which has excellent moldability, flame retardancy and solder crack resistance. SOLUTION: The epoxy resin composition consists of an epoxy resin represented by general formula (1) (wherein, m is 1 or 2, n is 0 or 1), a phenol resin, an accelerator and an inorganic filler.
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