发明名称 Semiconductor device and method for fabricating the same
摘要 An impurity diffusion layer serving as the source or the drain of a transistor is formed in a semiconductor substrate, and a protection insulating film is formed so as to cover the transistor. A capacitor lower electrode, a capacitor dielectric film of an oxide dielectric film and a capacitor upper electrode are successively formed on the protection insulating film. A plug for electrically connecting the impurity diffusion layer of the transistor to the capacitor lower electrode is buried in the protection insulating film. An oxygen barrier layer is formed between the plug and the capacitor lower electrode. The oxygen barrier layer is made from a composite nitride that is a mixture or an alloy of a first nitride having a conducting property and a second nitride having an insulating property.
申请公布号 US2002055223(A1) 申请公布日期 2002.05.09
申请号 US20010921884 申请日期 2001.08.06
申请人 KUTSUNAI TOSHIE;HAYASHI SHINICHIRO;MIKAWA TAKUMI;JUDAI YUJI 发明人 KUTSUNAI TOSHIE;HAYASHI SHINICHIRO;MIKAWA TAKUMI;JUDAI YUJI
分类号 H01L27/105;H01L21/02;H01L21/8246;(IPC1-7):H01L21/824;H01L21/20;H01L29/94 主分类号 H01L27/105
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