发明名称 |
Substrate for an electronic circuit, and an electronic module using such a substrate |
摘要 |
A substrate for an electronic circuit, the substrate comprising a wafer of silicon Si having a top face covered in an electrically insulating layer of silicon nitride SiN, said electrically insulating layer of silicon nitride supporting one or more conductive tracks obtained by metallizing the top face of said electrically insulating layer for the purpose of enabling one or more electronic components to be connected.
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申请公布号 |
US2002053720(A1) |
申请公布日期 |
2002.05.09 |
申请号 |
US20010951391 |
申请日期 |
2001.09.14 |
申请人 |
ALSTOM |
发明人 |
BOURSAT BENOIT;DUTARDE EMMANUEL;MEYSENC LUC;SAIZ JOSE;SOLOMALALA PIERRE |
分类号 |
H01L23/12;H01L23/14;H01L23/373;H01L23/538;H05K1/03;H05K3/18;H05K3/24;(IPC1-7):H01L29/82 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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