| 摘要 |
PROBLEM TO BE SOLVED: To provide a film forming method by sputtering, which can stably form a uniform and homogeneous film on a substrate even in a long sputtering time. SOLUTION: The film forming method for forming the film on the substrate by sputtering while transferring the substrate includes, controlling a transferring speed of the above substrate to compensate a film forming speed, and controlling an applied electric power to a heating means for the substrate, so as not to destroy a thermal equilibrium state of heating temperature of the above substrate because of a change in the above transferring speed, at forming the film on the substrate.
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