| 摘要 |
The present invention provides an inexpensive semiconductor module of large capacity capable of being formed into a small-sized semiconductor module without using any special assembling component irrespective of thickness of a semiconductor device to be packaged therein. A semiconductor module unit 6 is formed by packaging a bump electrode 3 of a semiconductor device 4 in electrode pad 5a that are disposed on upper and lower faces of a unit substrate 5. A mother substrate 17 is provided with upper and lower faces on which an electrode pad 17d of a circuit pattern is formed, and a center part in which welding balls of same diameter can be packaged. A semiconductor module unit 6 is arranged on both faces of the mother substrate 17 so that the semiconductor devices 4 may be inserted back to back with a small distance between them. The unit substrate 5 and the electrode pads 5b, 17d of the mother substrate 17 are conductively connected through a connection bump 18.
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