Epoxy resin composition for encapsulating semiconductor, and resin-encapsulated type semiconductor apparatus

摘要

Provided is an epoxy resin composition having lowmoisture absorption and excellent solder-crack resistance for encapsulating semiconductor comprising: (A) an epoxy resin represented by formula (1) (B) a curing agent having a phenolic hydroxyl group, and (C) inorganic filler in an amount of 60 to 98% by weight based on the whole composition, and the epoxy resin composition is preferably used for a resin-encapsulated type semiconductor apparatus.