| 摘要 |
PROBLEM TO BE SOLVED: To provide a epoxy resin composition for sealing a semiconductor, which is slightly bent and has excellent moldability and solder crack resistance. SOLUTION: The epoxy resin composition essentially consists of (A) an epoxy resin represented by formula (3), (B) a phenol resin represented by formula (4), (C) an inorganic filler of 84-94 wt.% in total, and (D) an accelerator.
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