| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for semiconductor sealing which is excellent in mold release properties, heat resistance, solder crack resistance, and continuous moldability. SOLUTION: This composition contains, as essential ingredients, (A) an epoxy resin, (B) a phenol resin, (C) a cure accelerator, (D) an inorganic filler, and (E) a fatty acid bisamide having an aromatic ring in the main chain backbone and formed from an 18-36C fatty acid.
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