Structure and package of a heat spreader substrate

摘要

A structure of a heat spreader substrate. A first heat spreader has a first upper surface, a corresponding first lower surface and an opening. A second heat spreader has a second upper surface and a corresponding second lower surface. The second heat spreader is fit tightly into the opening. The second lower surface and the first lower surface are coplanar. A thickness of the second heat spreader is smaller than that of the first heat spreader. A chip is located on the second upper surface. A substrate is located on the first upper surface of the first heat spreader, and the opening is exposed by the substrate.