MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To transfer a designated pattern well even when an exposure light over the wavelength of 200 nm is used in an exposure process using a resist mask. SOLUTION: When the exposure process for a semiconductor wafer 1W is carried out using the exposure light over wavelength of 200 nm EXP, a photomask MR on which a shielding light pattern 5 made by laminating a resist film 4a on a light absorbents organic film 3a with light absorbent for the exposure light EXP is placed, is used.