| 摘要 |
A semiconductor device is mounted on a heating stage, and the temperature of the semiconductor device is set to be at least 60° C. and lower than the melting point of the solder. With the use of an ejecting head, the molten solder is ejected from a nozzle towards an electrode part. The molten solder ejected from the ejecting head impinges upon the surface of the electrode part. By impingement, the molten solder spreads over the surface of the electrode part by wetting, thereby to form a bump electrode on the electrode part. This ensures a joining strength between the bump electrode and the underlying conductive region. |
