发明名称 |
METHOD AND DEVICE FOR MEASURING FILM THICKNESS |
摘要 |
<p>PROBLEM TO BE SOLVED: To highly precisely and quickly measure and control the film thickness of a specimen in film production due to deposition by a device in which a structure around the specimen is simple. SOLUTION: The film thickness measuring device comprises a board 11, an electron gun 12 for primary electron irradiation, a deposition device 13 for specimen deposition and a secondary electron detector 14. The electron gun 12 has a function capable of setting primary energy from 10 eV to 30 keV.</p> |
申请公布号 |
JP2002131036(A) |
申请公布日期 |
2002.05.09 |
申请号 |
JP20000323305 |
申请日期 |
2000.10.18 |
申请人 |
HITACHI LTD |
发明人 |
FURUKAWA TAKASHI;HOSOKI SHIGEYUKI |
分类号 |
G01B15/02;G01N23/225;H01J37/252;(IPC1-7):G01B15/02 |
主分类号 |
G01B15/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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