发明名称 METHOD AND DEVICE FOR MEASURING FILM THICKNESS
摘要 <p>PROBLEM TO BE SOLVED: To highly precisely and quickly measure and control the film thickness of a specimen in film production due to deposition by a device in which a structure around the specimen is simple. SOLUTION: The film thickness measuring device comprises a board 11, an electron gun 12 for primary electron irradiation, a deposition device 13 for specimen deposition and a secondary electron detector 14. The electron gun 12 has a function capable of setting primary energy from 10 eV to 30 keV.</p>
申请公布号 JP2002131036(A) 申请公布日期 2002.05.09
申请号 JP20000323305 申请日期 2000.10.18
申请人 HITACHI LTD 发明人 FURUKAWA TAKASHI;HOSOKI SHIGEYUKI
分类号 G01B15/02;G01N23/225;H01J37/252;(IPC1-7):G01B15/02 主分类号 G01B15/02
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